C.Uyemura & Co.,Ltd., together with its subsidiaries, engages in the research, development, manufacture, and sale of plating chemicals and surface finishing machinery in Japan, Taiwan, China, South Korea, Singapore, Thailand, North America, and internationally. It operates through Surface Treatment Materials Business, Surface Treatment Machinery Business, Plating Business, Real Estate Rental Business, and Other segments. The company offers plating chemicals and machines for printed circuit boards and aluminum magnetic disks, industrial chemicals, and non-ferrous metals. It also provides electronic circuit boards, including package boards, rigid and flexible printed wiring boards, plating equipment, and plating solution control systems; semiconductors, such as logic and memory devices; electric components comprising connectors, passive devices, and power devices; and functional plating, which includes pretreatment, composite and nickel plating. In addition, the company offers copper plating and final finish process, electroless plating, and aluminum hard disk media Ni-P plating processes, as well as electrolytic plating process for bump formation; chemical pre and post treatment, and stripper, as well as chromium, zinc, tin and tin alloy, gold, silver, and palladium plating; polishing compounds solutions, such as solid and liquid buffing, and barrell, as well as polishing equipment; and surface finishing systems. Further, it is involved in the leasing of office buildings, condominiums, and factory land. C.Uyemura & Co.,Ltd. was founded in 1848 and is headquartered in Osaka, Japan.
